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Product Description
Polysynthetic silver thermal compound paste maximizes thermal conductivity between the CPU and heat sink/fan assembly. [Read more]
Features
- Weight: 1.0g/tube
- Operation Temperature: -50/180°c
- Thermal Conductivity: >3.17W/m.k
- Thermal Resistance: <0.067°c-in2/w
- 20% metal oxide compounds
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Details were last updated on Mar 23, 2026 23:36 +08.
